Product Features:
Connect the new 800G site to the existing 400G site via 2x400G breakouts
Built-in Broadcom 7nm DSP chip, the maximum power consumption is 16.5W
The self-developed 53G EML laser chip ensures production safety
Parametric testing ensures excellent performance, quality and reliability
The high-speed connection complies with IEEE 802.3ck standards and IEEE 802.3cu-2021
Hot-swappable OSFP MSA compliant
Supports 2x400G or 8x100G breakouts for higher port density
8x106.25G PAM4 retiming 800GAUI-8 electrical interface